Lenovo LF80565QH0254M Datový list stáhnout pdf (Strana 60)

Mechanical Specifications

60 Document Number: 318080-002

3.2 Processor Component Keepout Zones

The processor may contain components on the substrate that define component

keepout zone requirements. A thermal and mechanical solution design must not

intrude into the required keepout zones. Decoupling capacitors are typically mounted

to either the topside or pin-side of the package substrate. See Figure 3-4 and

Figure 3-5 for keepout zones.

1 2 ... 55 56 57 58 59 60 61 62 63 64 65 ... 141 142

Processor 7200 Series 1
Contents 3
4 Document Number: 318080-002 4
Document Number: 318080-002 5 5
6 Document Number: 318080-002 6
Document Number: 318080-002 7 7
Revision History 8
1 Introduction 9
1.1 Terminology 11
Introduction 12
1.2 State of Data 13
1.3 References 13
2 Electrical Specifications 15
Clocking 16
2.3.2 PLL Power Supply 17
Electrical Specifications 18
Table 2-4. FSB Signal Groups 21
Asynchronous Signals 22
2.9 Mixing Processors 23
CC_VTT_OUT 27
Time Duration (s) 28
Sustained Current (A) 28
Table 2-10. V 30
Load Lines 32
Static and Transient 34
Tolerance Load Lines 34
Specifications 35
2.11.2.1 DC Characteristics 36
2.11.3 V 37
Overshoot Specification 37
Example Overshoot Waveform 38
Tp = T1: BCLK[1:0] period 47
THERMTRIP# 51
Figure 2-26. VID Step Timings 54
3 Mechanical Specifications 57
Mechanical Specifications 58
3.7 Processor Materials 67
3.8 Processor Markings 68
Processor 69
4 Pin Listing 71
10 of 16) 75
11 of 16) 76
12 of 16) 76
13 of 16) 77
14 of 16) 77
15 of 16) 78
16 of 16) 78
1 of 14) 79
2 of 14) 79
3 of 14) 80
4 of 14) 80
5 of 14) 81
6 of 14) 81
8 of 14) 82
7 of 14) 82
9 of 14) 83
10 of 14) 83
11 of 14) 84
12 of 14) 84
13 of 14) 85
14 of 14) 85
Pin Listing 86
5 Signal Definitions 87
CC and BCLK have reached 92
6 Thermal Specifications 95
CASE_MAX 96
Thermal Profile 98
= 0.162 x Power + 45 98
Pow er (W) 100
Temperature (C) 100
= 0.420 x Power + 45 100
= 0.238 x Power + 45 101
6.1.2 Thermal Metrology 102
6.2.2 Thermal Monitor 103
6.2.3 Thermal Monitor 2 104
6.2.4 On-Demand Mode 105
6.2.5 PROCHOT# Signal 106
6.2.6 FORCEPR# Signal 106
6.2.7 THERMTRIP# Signal 106
6.3.1 Introduction 107
6.3.2 PECI Specifications 108
7 Features 111
7.2.1 Normal State 112
EXTENDED_HALT 113
7.2.3 Stop-Grant State 114
7.3 Enhanced Intel SpeedStep 115
Technology 115
Features 116
7.4.1 SMBus Device Addressing 117
Transactions 118
7.4.3.1 Header 121
7.4.3.2 Processor Data 125
7.4.3.3 Processor Core Data 126
16h-19h 127
1Ah-1Bh 127
Offset: 1Ch 128
1Dh-1Eh 128
1Fh-20h 128
7.4.3.4 Cache Data 129
7.4.3.5 Package Data 131
7.4.3.6 Part Number Data 132
38h-3Eh 133
3Fh-4Ch 133
4Dh=54h 133
55h-6Eh 134
71h-72h 134
7.4.3.8 Feature Data 135
7.4.3.9 Other Data 136
7.4.4 Checksums 137
7.4.5 Scratch EEPROM 137
8.1 Introduction 139
8.2 Thermal Specifications 139
9 Debug Tools Specifications 141
Debug Tools Specifications 142

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